Job Requirements: Requires a Masters degree in Electrical Engineering, Materials Science, or a directly related field plus five (5) years of experience in device packaging, specifically: (i) selection of materials for the package, components, and device assembly; (ii) development of processes for the use of those materials in device assembly; and (iii) testing of materials and devices for packaging requirements. Must have at least four (4) years of experience with the following: Experimental Design, Statistical Analysis, Failure Analysis, Reliability Testing, Creation of process documentation, Exposure to flip chip or wirebonding technologies, Microscopy, SEM and Material Analysis, Use of statistical analysis software. This position will require domestic travel up to 5% of the time to other MACOM sites, vendor, and possible customer interactions. 40 hours/week, 9:00am-5:00pm. Qualified applicants please submit resume to Macom's website. Requisition ID 2385. MACOM Technology is an Equal Opportunity Employer.